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datashee t product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 20 tsz02201-0g1g0b300360-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.jun.2015 rev.002 tsz22111 ? 14 ? 001 www.rohm.com motor / actuator / drivers for dc brush motor series automotive 6ch half bridge driver with spi control bd16936efv- m general description the BD16936EFV-M is 6ch half bridge driver for automotive applications. it can drive compact dc brush motors directly and each output can be controlled in three modes (high, low and high impedance). mcu can control the driver via 16bit serial interface (spi). the part is 60v rated with low on resistance packaged in compact htssop-28 package, which contributes to realize high reliability, low energy consumption and low cost. features aec -q100 qualified (note 1 ) 1.0a dmos half bridge 6 circuits three modes control (high output, low output, hi - z) low standby current built-in protection diode against output reverse voltage over current detection(ocd) over voltage protection at output power supply stage(ovp) under voltage lock out at output power supply stage(uvlo) thermal shut down(tsd) (note 1: grade 2) applications (note 2 ) automotive body electronics, hvac, door mirrors, etc. key specifications supply voltage 8v to 36v operating temperature range -40c to +110c output current 1.0a output on resistance (high side) 2.00(t yp ) output on resistance (low side) 1.3 0(t yp ) package w(typ) x d(typ) x h(max) htssop-b28 9.70mm x 6.40mm x 1.00mm htssop-b28 typical application circuit bd16936efv out1 out2 out3 out4 out5 out6 micro controller en csb sdi sck sdo voltage regulator vcc vs2 vs1 vs3 (note 2 ) please make sure you consult our company sales representative be fore mass production of this ic, if used other than door mirror and hvac. figure 1. typical application circuit downloaded from: http:///
2/ 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 pin configuration out1 pgnd1 out2 out4 pgnd1 out3 vs1 nc test3 test2 vs2 vs2 agnd test1 sdi sck csb en pgnd2 out6 vcc pgnd2 sdo out5 vs3 vs3 nc nc 12 3 4 5 6 7 8 9 10 11 12 28 27 26 25 24 23 22 21 20 19 18 17 13 14 16 15 thermal pad ( gnd ) pin description pin no. symbol function pin no. symbol function 1 agnd small signal gnd (note 1) 28 nc - 2 test1 test1 input (note 2) 27 vcc power supply 3 test2 test2 input (note 2) 26 en enable input 4 test3 test3 output (note 3) 25 csb spi chip select input 5 nc - 24 sck spi clock input 6 vs1 power supply 1 at output stage 23 sdi spi data input 7 out1 half bridge output 1 22 s do spi data output 8 out2 half bridge output 2 21 pgnd2 output gnd2 9 pgnd1 output gnd1 20 pgnd2 output gnd2 10 pgnd1 output gnd1 19 out6 half bridge output 6 11 out3 half bridge output 3 18 out5 half bridge output 5 12 out4 half bridge output 4 17 nc - 13 vs2 power supply 2 at output stage 16 vs3 power supply 3 at output stage 14 vs2 power supply 2 at output stage 15 vs3 power supply 3 at output stage (note 1) connect to adgnd for power dissipation. (note 2) connect test1 and test2 to agnd (n ote 3) keep test3 electrically open. figure 2. pin configuration (htssop-b28) downloaded from: http:///
3/ 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 block diagram spi & control logic csb sck sdi en sdo out1 out2 out3 vs1 out4 out5 out6 vs3 driver & over current detect driver & over current detect driver & over current detect driver & over current detect driver & over current detect driver & over current detect gnd pgnd1 pgnd2 vcc over voltage protection under voltage lockout thermal shutdown power on reset vs2 pgnd3 vcc figure 3. block diagram downloaded from: http:///
4/ 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 absolute maximum ratings (ta = 25c) parameter symbol limit unit power supply voltage v vs1 , v vs2 , v vs3 -0.3 to + 60 v driver supply voltage v cc -0.3 to +7.0 v output voltage v out1 to v out6 -0.3 to + 60 v output current (note 1) i o 1.0 a power dissipation (note 2) pd 4.70 w logic input voltage v sdi , v sck , v csb , v en -0.3 to v cc +0.3 v logic output voltage v sdo -0.3 to v cc +0.3 v sdo output current i sdo 5.0 ma op erating temperature range topr - 40 to +110 c storage temperature range tstg - 55 to + 150 c junction temperature tjmax 150 c (note 1) pd, aso should not be exceeded (note 2) reduce 37.6mw per 1 c above 25 c (mount on 4-layer 70.0mm x 70.0mm x 1.6mm board) caution: operating the ic over the absolute maximum ratings may damage the ic. t he damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. th erefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated o ver the absolute maximum ratings. recommended operating conditions (ta=-40c to +1 10 c parameter symbol min typ max unit power supply voltage (note 3) v vs1 , v vs2 , v vs3 8 12 36 v dr iver supply voltage (note 3) v cc 4.5 5 5.5 v logic input voltage (note 3) v en , v csb , v sck , v sdi -0.3 +5 +5.5 v (note 3) in order to start operation, apply the voltage to vcc (drive r supply voltage) after vs (power supply voltage) exceeds the minimum operating voltage range (8v). in order to start operation, apply the voltage to logic input voltag e after vcc (driver supply voltage) exceeds the minimum operating voltage range (4.5v). downloaded from: http:///
5/ 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 electrical characteristics (unless otherwise specified, v vs1 , v vs2 , v vs3 = 8v to 36v, v cc = 4.5v to 5.5v, ta = - 40 c to +110c) parameter symbol specification unit conditions m in t yp m ax circuit current vs1 to 3 circuit current1 i vcc1 - 0 10 a en=low vs1 to 3 circuit current 2 i vcc2 - 3.5 . 14 ma vcc circuit current 1 i vcc1 - 0 10 a en=low vcc circuit current 2 i vcc2 - 5 9 ma output characteristics output on resistance high side 1 r onh1 - 1.25 2.0 io = 0.1a to 0.8a, ta = - 40 c to + 25 c output on resistance high side 2 r onh2 - 2.0 2.55 io = 0.1a to 0.8a, ta = 25c to 110c output on resistance low side 1 r onl1 - 0.85 1.35 io = 0.1a to 0.8a, ta = - 40 c to + 25 c output on resistance low side 2 r onl2 - 1.3 1.7 io = 0.1a to 0.8a, ta = 25c to 110c output leakage high side i lh - 0 10 a out1 to out6 = 0 .0 v output leakage low side i ll - 0 10 a out1 to out6 = v vs1 = v vs2 = v vs3 output diode voltage high side v fh 0.2 0. 9 1.4 v i f = 0.6a output diode voltage low side v fl 0.2 0. 9 1.4 v i f = 0.6a serial input characteristics input high voltage v ih vcc 0.6 - - v input low voltage v il - - vcc 0.2 v input high current 1 i ih1 - 50 100 a vcc = sdi, sck, en = 5.0v input high current 2 i ih2 - 0 10 a vcc = csb = 5.0v input low current 1 i il1 - 0 10 a sdi, sck, en = 0.0v input low current 2 i il2 - 50 100 a csb = 0.0v, vcc=5v serial output characteristics output high voltage v oh vcc-0.6 - - v i oh =-1.0ma output low voltage v ol - - 0.6 v i oh =1.0ma protections vs1 to 3 under voltage detection v uvd 4.1 4.6 5.1 v v s1 to 3 under voltage hysteresis v uvhys 0.3 0.5 0.7 v vs1 to 3 over voltage detection v ovp 45 50 55 v vs1 to 3 over voltage hystersisis v ovphys 3 5 7 v over current detection i ocd 1.05 1.5 1.95 a over current detection delay time t delay 10 25 50 s thermal shutdown (note 1) t tsd 150 175 200 c thermal shutdown hysteresis (note 1) t tsdhys - 25 - c (note 1) design guaranteed. not tested at outgoing. downloaded from: http:///
6/ 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 electrical characteristics (unless otherwise specified, v vs1, v vs2, v vs3 = 8v to 36v, v cc = 4.5v to 5.5v, ta = - 40 c to +110 c ) parameter symbol specification unit conditions m in t yp m ax driver output timing high side turn on time t tonlh - - 33.0 s v vs1 = v vs2 = v vs3 = 12v, r load = open low side turn on time t tonhl - - 33.0 s v vs1 = v vs2 = v vs3 = 12v, r load = open out rise time t lhr - 1.0 8.0 s v vs1 = v vs2 = v vs3 = 12v, r load = open out fall time t hlf - 1.0 8.0 s v vs1 = v vs2 = v vs3 = 12v, r load = open figure 4. driver output timing ( low ? high) figure 5. driver output timing ( high ? low) csb out x low ? high t tonlh t lhr 90% 10% csb out x high ? low t tonhl t hlf 90% 10% downloaded from: http:///
7/ 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 electrical characteristics (unless otherwise specified, v vs1, v vs2, v vs3 = 8v to 36v, v cc = 4.5v to 5.5v, ta = - 40 c to +110 c ) parameter symbol specification unit conditions m in t yp m ax sck frequency f sck - - 1 mhz sck period t sck 1000 - - ns sck high time t sckh 250 - - ns sck low time t sckl 250 - - ns sck setup time t sckset 250 - - ns sck hold time t sckhld 250 ns csb lead time t csblead 500 - - ns csb lag time t csblag 500 - - ns csb high time t csbh 20 - - s sdi setup time t sdiset 200 - - ns sdi hold time t sdihld 200 - - ns sdo valid time t sdov - - 250 ns sdo enable after csb falling edge t sdoen - - 500 ns sdo disable after csb rising edge t sdode - - 500 ns sdo (ter=0) sdi csb sck msb 14 1 lsb msb 14 1 lsb t sckset t csblead t sck t csblag t csbh t sckh t sckl t sckhld t sdiset t sdihld t sdov t sdoen t sdode 0.7v vcc 0.2v vcc 0.7v vcc 0.2v vcc 0.7v vcc 0.2v vcc 0.7v vcc 0.2v vcc x sdo (ter=1) t sdoen t sdode x 0.7v vcc 0.2v vcc high impedance high impedance high impedance high impedance x unstable state ter (internal signal) : 0 in normal operation / 1 in detecting erroneous spi transmission figure 6. serial interface timing downloaded from: http:///
8/ 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 typical performance curves (unless otherwise specified, v vs1, v vs2, v vs3 = 8v to 36v, ta = - 40 c to +110c) 0.0 0.5 1.0 1.5 2.0 2.5 0.0 0.2 0.4 0.6 0.8 1.0 output current io[a] high side output on resistance [] 0.0 0.5 1.0 1.5 2.0 2.5 0.0 0.2 0.4 0.6 0.8 1.0 output current io[a] high side output on resistance [] 0.0 0.3 0.6 0.9 1.2 1.5 0.0 0.2 0.4 0.6 0.8 1.0 output current io[a] low output on resistance [] 0.0 0.3 0.6 0.9 1.2 1.5 0.0 0.2 0.4 0.6 0.8 1.0 output current io[a] low output on resistance [] figure 7. output on resistance vs output current (output on resistance high side, v vs =12v) ta=25c ta=- 40 c ta=110c figure 9. output on resistance vs output current (output on resistance low side, v vs =12v) ta=110c ta=- 40 c ta=25c figure 10. output on resistance vs output current (output on resistance low side, ta=25c ) figure 8. output on resistance vs output current (output on resistance high side, ta=25c ) v vs =8v v vs =36v v vs =12v v vs =12v v vs =8v v vs =36v v cc = 5v test1=test2=0v v cc = 5v test1=test2=0v v cc = 5v test1=test2=0v v cc = 5v test1=test2=0v downloaded from: http:///
9/ 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 operation of each block 1. serial peripheral interface: spi csb sdi sck sdo ( ter=0 ) msb 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 lsb 0 msb 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 lsb 0 sdo ( ter=1 ) all "high" x x x unstable state ter (internal signal) : 0 in normal operation / 1 in detecting erroneous spi transmission 16bit serial interface is equipped to control on / off of driver and va rious protections as well as to read out the state of protections. input / output register and its functions are describe d below. (1) input data register bit number name description bit status initial value 15 srr status reset register ( this bit is self clear ) 0 : normal 1 : reset 0 14 hsc1 control high side 1 0 : high side off 1 : high side on 0 13 lsc1 control low side 1 0 : low side off 1 : low side on 0 12 hsc2 control high side 2 0 : high side off 1 : high side on 0 11 lsc2 control low side 2 0 : low side off 1 : low side on 0 10 hsc3 control high side 3 0 : high side off 1 : high side on 0 9 lsc3 control low side 3 0 : low side off 1 : low side on 0 8 hsc4 control high side 4 0 : high side off 1 : high side on 0 7 lsc4 control low side 4 0 : low side off 1 : low side on 0 6 hsc5 control high side 5 0 : high side off 1 : high side on 0 5 lsc5 control low side 5 0 : low side off 1 : low side on 0 4 hsc6 control high side 6 0 : high side off 1 : high side on 0 3 lsc6 control low side 6 0 : low side off 1 : low side on 0 2 tsdsth tsds register mode 0 : latch 1 : through 0 1 pssth ovps / uvlos register mode 0 : latch 1 : through 0 0 reserve reserve 0 : normal 1 : prohibit 0 input of high side on and low side on via spi control is prohibited. the inp ut f high side on and low side on results in high side off and low side off state. daisy chain is not recommended due to its reliability concern. con nect chip select (csb) to each device and run by spi parallel control instead. figure 11 :spi communication format downloaded from: http:///
10 / 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 (2) output data register bit number name description bit status initial value (note 1) 15 ocds over current detection status 0 : normal 1 : fault 1 (note 1) 14 hss1 high side 1 status 0 : high side off 1 : high side on 0 13 lss1 low side 1 status 0 : low side off 1 : low side on 0 12 hss2 high side 2 status 0 : high side off 1 : high side on 0 11 lss2 low side 2 status 0 : low side off 1 : low side on 0 10 hss3 high side 3 status 0 : high side off 1 : high side on 0 9 lss3 low side 3 status 0 : low side off 1 : low side on 0 8 hss4 high side 4 status 0 : high side off 1 : high side on 0 7 lss4 low side 4 status 0 : low side off 1 : low side on 0 6 hss5 high side 5 status 0 : high side off 1 : high side on 0 5 lss5 low side 5 status 0 : low side off 1 : low side on 0 4 hss6 high side 6 status 0 : high side off 1 : high side on 0 3 lss6 low side 6 status 0 : low side off 1 : low side on 0 2 tsds thermal shutdown status 0 : normal 1 : fault 1 (note 1) 1 ovps over voltage protection status 0 : normal 1: fault 1 (note 1) 0 uvlos uvlo ( vs ) status 0 : normal 1 : fault 1 (note 1) (note 1) : default is 1 ( fault ) . set srr regist er 1 before use and reset the values. either latch or self recovery are selectable on uvlos, ovps and tsds error outp ut registers. only latch is available on ocds error output register. < pssth , tsdsth > under voltage lock out uvlos over voltage protection ovps thermal shut down tsds over current detection ocds < 0 , 0 > latch latch latch latch < 0 , 1 > latch latch self recovery latch < 1 , 0 > self recovery self recovery latch latch < 1 , 1 > self recovery self recovery self recovery latch refer to the explanations of protection functions as far as out 1 to 6 operations are concerned. (3) erroneous spi transmission (transmission error : ter) when sck inputs high pulse of 16, 24, 32, (8+8xn values) while csb is low, erroneous spi trans mis sion is detected. if the error is detected, out1 to 6 outputs high impedance and each error output register (ocd s, tsds, ovps and uvlos) maintains the prior status accordingly. at the same time, if the csb high period (t csbh ) goes below the specified 20s, an erroneous spi transmission can be detected. the transmission e rror status is refreshed every time csb rises. ter (internal signal) : 0 in normal operation / 1 in detecting erroneous spi transmission downloaded from: http:///
11 / 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 2. over voltage protection (ovp) all outputs run into high impedance when vs1 to 3 terminal voltage goes up to or above 50v (t yp ). ovps register is set 1 in this case. the outputs come back when vs1 to 3 terminal voltage goes down to or below 45v (t yp ) and return to the normal operation. th e state of output data register ovps can be either latch or self recovery de pending on the state of input data register pssth. input data register pssth=0 and output data register opvs=1 for latch. input data register pssth=1 and output data register ovps for self recovery when vs1 to 3 termi na l voltage goes down to or below 45v (t yp ). ovp doesnt operate when en terminal is at low level. be sure not to exceed the absolute maximum power supply voltage to avoid the ic being destructed. 50v(typ) 45v(typ) out1/2/3/4/5/6 high impedance operating normal protection normal vs1,2,3 pss error bit(ovps) low high pssth=0 pss error bit(ovps) pssth=1 low high 3. under voltage lock out (uvlo) all outputs run into high impedance when vs1 to 3 terminal voltage goes down to or below 4.6v (t yp ). uvlos register is set 1 in this case. outputs come back when vs1 to 3 terminal voltage goes up to or above 5.1v (t yp ) and return to the normal operation mode. output data register uvlos in this case c an be either latch or self recovery depending on the status of input data register pssth. input data register pssth=0 and o utput data register uvlos= 1 for latch. input data register pssth=1 and output data register uvlos for self recovery when vs1 to 3 terminal voltage goes up to or above 5.1v (t yp ). 5.1v(typ) 4.6v(typ) out1/2/3/4/5/6 high impedance operating normal protection normal vs1,2,3 pss error bit(uvlos) low high pssth=0 pss error bit(uvlos) pssth=1 low high figure 12. ovp timing chart figure 13. uvlo timing chart downloaded from: http:///
12 / 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 4. over current detection (ocd) when 1.5a (t yp ) current flows into the outp ut terminal, overcurrent is detected and ocds register is set 1. only th e overcurrent detected output stage is latched at high impedance. in order to release the latch in this case, it has to be res et via srr register or en terminal. also 25s (t yp ) delay time is programmed to avoid the malfunction caused by noi se. ocd is the function to protect the ic from destruction caused by outp ut short. however, the continuous overcurrent condition could lead the ic heating up or degraded and thus an ap propriate measure has to be taken such as placing the ic into stand-by mode by application when overcurrent condition continues. 1.5a(typ) out1/2/3/4/5/6 ocd error bit(ocds) normal protection(latch) high impedance operating high low 5. thermal shut down (tsd) when junction temperature goes up to or above 175c (t yp ), all outputs turn into high impedance . tsds register is set 1 in this case. self recovery kicks in when the junction temperature goes down to o r below 150c (t yp ) and outputs come back and return to the normal operation. tsds register in this case is maintain ed at 1. output d ata register tsds can be either latch or self recovery depending on the input data register tsdsth st atus. input data register tsdsth=0 and output data register tsds=1 for latch. input data register tsdsth=1 and outp ut data register tsds for self recovery when the junction temperature goes down to or below 150 (typ). 175 c(typ) 150 c(typ) out1/2/3/4/5/6 tsd error bit(tsds) high impedance operating high low normal protection normal temperature tsdsth=0 tsd error bit(tsds) tsdsth=1 low high figure 1 4. ocd timing chart figure 1 5. tsd timing chart downloaded from: http:///
13 / 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 recommended application example the external circuit constants shown in the diagram above re present a recommended value, respectively. cautions on designing of application circui ts 1. applicable motors be noted that the BD16936EFV-M motor driver can only drive dc motors and ca nnot drive stepping motors. 2. vs1, vs2, vs3 and vcc be sure to mount a power supply capacitor in the vicinity of the ic pins between the vs and pgnd and between the vcc and gnd. determine the capacitance of the capacitor after fully ensuring that it presents no problems in characteristics. ( the recommended value of between vs and pgnd is 4.7 f or more. the recommended value of between vcc and gnd is 1.0 f or more.) furthermore, cause a short circuit between vs1, vs2 and vs3 (set them to the same potential) before using the ic. 3. counter-electromotive force the counter-electromotive force may vary with operating conditio ns and environment, and individual motor characteristics. fully ensure that the counter-electromotive force presents no pro blems in the operation or the ic. 4. fluctuations in output pin voltage if any output pin makes a significant fluctuation in the vol tage to fall below gnd potential due to heat generation conditions, power supply, and motor to be used, or other conditions, this may result in malfunctions or other failur es. in such cases, take appropriate measures, including the additi on of a schottky diode between the output pin and ground. 5. rush current this ic has no built- in circuit that limits rush currents caused by applying curre nt to the power supply or switching operation mode. to avoid the rush currents, take physical m easures such as adding a current-limiting resistor betwee n vs1, vs2 and vs3 pins and the power supply. 6. thermal pad since a thermal pad is connected to the sub side of this ic, connect it to the ground potential. furthermore, do not use the thermal pad as ground interconnect. agnd 1 2 test1 test2 3 test3 4 nc out1 5 out2 7 pgnd1 8 pgnd1 9 out4 10 12 en 24 23 csb sck 22 sdi 21 pgnd2 19 pgnd2 18 out6 17 out5 16 nc 15 vs3 BD16936EFV-M motor 1 4.7 f vs1 6 out3 11 sdo 20 vs3 vs2 14 vs2 13 28 27 26 25 nc vcc motor 2 motor 3 micro controller voltage regulator 1f m m m figure 16. recommended application example downloaded from: http:///
14 / 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 power dissipation (1): rohm standard board (70 .0 [mm] 70 .0 [mm] 1.6[mm], glass epoxy board 4 layer, copper foil area 7070[ mm]) (2): rohm standard board (70 .0 [mm] 70 .0 [mm] 1.6[mm], glass epoxy board 2 layer, copper foil area 707 0[mm]) (3): rohm standard board (70 .0 [mm] 70 .0 [mm] 1.6[mm], glass epoxy board 2 layer, copper foil area 15 15 [mm]) figure 17. BD16936EFV-M power dissipation 0 1.0 2.0 3.0 4.0 5.0 25 50 75 100 125 150 (3) 1.85w pd w temperature (c) 0.5 1.5 2.5 3.5 4.5 5.5 6.0 (1) ja=26.6c/w (2) ja=37.9c/w (3) ja=67.6c/w 110 (2) 3.30w (1) 4.70w downloaded from: http:///
15 / 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 i/o equivalent circuits pin no. pin name i/o equivalence circuit 2 3 23 24 26 test1 test2 sdi sck en test1/test2 sdi/sck/en 10k 100k 2 3 23 24 26 agnd 1 agnd 1 vcc 27 4 test3 test3 4 agnd 1 500 7 8 11 12 18 19 out1 out2 out3 out4 out5 out6 vs1/2/3 out1/2/3/4/5/6 pgnd1/2 6 13 14 15 7 8 11 12 18 19 9 10 20 21 16 22 sdo vcc sdo agnd 27 22 1 agnd 1 15 25 csb csb 10k 100k 25 agnd 1 agnd 1 vcc 27 resistance values shown in the diagrams above represent a typical limit, respe ctively. downloaded from: http:///
16 / 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting t he analog block. furthermore, connect a capacitor to ground at all power s upply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground tra ces, the two ground traces should be routed separately but connected to a single ground at the reference point of the a pplication board to avoid fluctuations in the small-sign al ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be ex ceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is w hen the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent excee ding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and dela ys, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each pr ocess or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground t he ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each o ther especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as metal parti cles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during as sembly to name a few. downloaded from: http:///
17 / 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 operational notes - continued 11. unused input pins input pins of an ic are often connected to the gate of a mos tra nsistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutua l interference among circuits, operational faults, or physica l damage. therefore, conditions that cause these diodes t o operate, such as applying a voltage lower than the gnd vol tage to an input pin (and thus to the p substrate) should be avoided. figure 18. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric co nstant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and p ower dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that preven ts heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the ra ting is exceeded for a continu ed period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circui t that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous ope ration or transitioning of the protection circuit. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
18 / 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 ordering information b d 1 6 9 3 6 e f v - me 2 part number package efv: htssop-b28 packing and forming specification m: automotive grade e2: embossed tape and reel marking diagrams htssop- b2 8 (top view) part number marking lot number 1pin mark bd 1 69 36 e f v downloaded from: http:///
19 / 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 physical dimension, tape and reel information package name htssop-b28 downloaded from: http:///
20 / 20 BD16936EFV-M tsz02201-0g1g0b3 00 360-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 19 .jun.2015 r ev .0 02 revision history date revision changes 18.dec.2013 001 new release 19.jun.2015 00 2 p1 note1,2 add comment p2,5,4,10 repair note number all update latest format downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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